3.5G/4G mobile phone, High-speed wireless communication, Mobile TV to receive Grand digital wave, Telematice and car navigation on board and many other mobile products are fundamental for Ubiquitous society and the usage of the mobile products have been expanding throughout the mobility society.
The event ﾒMobile Component Forum 2004ﾓ just only focus on components for mobile products. The event is place where advanced mobile component technologies and engineers of mobile set maker exchange technical information for further business development.
This technical exchanging is surely effective matchmaking.
Because Communication between them can make possible to catch set makers needs and propose solutions to set makers.
Companies who want to have develop business on Japanﾕs mobile component market should be at Mobile Component Forum 2004.







Exhibition
name		 Mobile Component Forum 2004
(Concurrently-held with EXPO COMM WIRELESS)
Date July 21 - 23, 2004
10：00〜17：30（Final day until 17：00）
Venue Tokyo Big Sight　East Hall 2
（Tokyo International Exhibition Center）
Organized by RIC TELECOM CO.,Ltd
E.J. Krause & Associates, Inc.
Supported by KOGYO CHOSAKAI Publishing Co., Ltd.
The number of
exhibitors		 40 companies and 600sqm expected
Admission Fee Free
Attendee 6,000 from Mobile equipment technology field.
The event consists of exhibition, Symposium and commercial presentation.